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2024 5th International Conference on Artificial Intelligence Applications and Technologies (AIAAT 2024)

Welcome to the official website of 2024 5th International Conference on Artificial Intelligence Applications and Technologies (AIAAT 2024). AIAAT 2024 will be held at Tunku Abdul Rahman University of Management and Technology, Kuala Lumpur, Malaysia from Sept. 26-28, 2024, which is organized by Hong Kong Society of Mechanical Engineers(HKSME).

AIAAT 2024 features invited keynote speech, peer-reviewed paper presentations, and academic visit. The conference is completely open (one needs to register first…), you will not have to be an author or a discussant to attend. This conference is aimed at providing a platform for all researchers and engineers to share ideas, highly developed skills and successful practices to others. We would like to invite you to join us in this important event and share your recent advance development and research finding in Artificial Intelligence Applications and Technologies to all attendees.We're looking forward to seeing you in AIAAT 2024.

 

Publication & Indexing

Selected papers(accepted and presented) with great extension will be recommended to publish in Special Issue of Applied Sciences (ISSN 2076-3417): "Machine Learning and Computational Intelligence in Sensors, Signals and Networks" after conference. The publisher will submit articles to SCIE, Scopus and other databases for review and indexing after publication.

 

Peer Review Policy

All submissions to the AIAAT will be sent to 2-3 independent reviewers for peer review. Reviewers evaluate submissions based on the requirements of the conference proceedings, predefined criteria, and quality, completeness, originality and grammar of the research presented. The notification of acceptance or reject will be sent to authors when the peer review is done. Manuscript requirements:

1. Manuscripts must be written in English;
2. The topics of paper should be relevant to conference topics;
3. Plagiarism and Duplicate submission are prohibited;
4. Innovation and scientific value is a must.

Paper Template

The paper should be formatted according to the template: Abstract Template

* Abstract Submission (Only for presenting research at conference, without publishing any paper): You only need to submit the title and abstract of your speech.

Submission

Authors can submit manuscripts through CMT electronic submission system. Please click following link:Electronical Submission System

First-time users should register a account firstly, then upload your paper to the system. Previous users can log in the CMT system directly.

If your paper need to be updated after you receive the submission confirmation, please send the updated paper to conference email aiaat@vip.163.com directly, please do not update in Electronic Submission System.

Important Dates

The First Round

Abstract Submission Deadline:
Mar. 30, 2024

Notification of Acceptance:
Apr. 30, 2024

Registration deadline:
May 30, 2024

The Second Round

Abstract Submission Deadline:
May 25, 2024

Notification of Acceptance:
Jun. 25, 2024

Registration deadline:
Jul. 25, 2024


Call for Participants

Presenter

The conference is now accepting oral presentation and poster presentation. If you are interested in presenting your research on the conference, without publishing your paper in the proceeding, please submit the abstract to us.

Listener

If you are interested in attending the conference to participate in this gathering in the field of Conference on Power and Electrical Engineering, you are welcome to join us and share your ideas! You need to download the registration form and fill in it, then send the filled form to conference.

Registration Now

Sponsor

AIAAT 2024 aims at attracting a great number of power and electrical engineering research and applications people from both the academic and industrial communities, We believe that it is a very good chance for our sponsors to show their R&D capacities and the recent research achievements to potential customers on this effective platform.